|Sn/Pb/Bi low temperature|
|Any alloy available|
|Code||Alloy||melting temperature（℃）||Product feature, purpose and precautions|
|HG6-2||Sn60Pb40||183||190|| •The pure tin is with no slag, but high average composition;
•Good oxidation resistance, with a significant reduction in solder oxidation waste;
•Good wettability, diffuse flow and ability to fill welds;
•Bright, round and beautiful solder joints;
•Suitable for modern dip, trailing and wave soldering applications.
1、When using it, select the appropriate flux with the corresponding solder;
2、It is suggested that the welding temperature should be controlled above 40℃~60℃ of the liquidus;
3、When mixed with other solders, it may reduce its performance.